Surface Coating: Full Strips / Stamped Strips

Bonding Surfaces (thick wire and thin wire bonding):

•    Nickel (bondable) | Ni
•    Copper | Cu
•    Nickel Nano Palladium and Fine Gold | Ni-Pd-Au

Surfaces for Contact Techniques:

•    Hard Gold | AuCo
•    Palladium | Pd
•    Palladium/Nickel | Pd/Ni 80/20
•    Silver | Ag
•    Nickel | Ni (matt/gloss, Sandwich-Nickel)
•    Copper | Cu
•    Tin | Sn (matt/gloss)
•    ZinnEP | SnAg
•    Tin alloy | SnPb (matt/gloss)
•    Top-Coating
•    Electropolish

Dimensions:up to 1.5 mm strip thickness, up to 180 mm strip width
Coil Weight:up to 1.500 kg (horizontal and vertical coiling and unreeling)
Coil Diameter:up to 1.400 mm diameter
Special Processes:stainless steel-direct Gold plating, Gold strip thickness min. 1 mm, internal spring
:Gold plating, spot plating, reflow-Tin, special cleaning process (50 µm particle),
:passivating (organic, metallic), greasing, laminating, recoiling        
Services:special packaging, logistics transactions