Taping Process

With the "Taping Process", special chemical consistent adhesive films are applied to the areas on the cleaned strip surface that are not to be plated. After plating by means of the depth controlled process, the adhesive film is removed.

The quality of the cleaned surface, quality of the adhesive film, flow velocity and current affect the quality of the plating significantly.

The "Taping Process" is ideal for selective full-strip refinement.