Depth Controlled Process

In the "Depth Controlled Process" the electrolyte is pumped from a reservoir into the processing cell. It circulates along both sides of the immersed product at a defined flow velocity. The product to be plated is cathodically switched and guided past anodes. Anode/cathode separation distance, flow velocity, current and immersion depth affect the quality of the plating significantly. Perfect for selective or full plating of solid and stamping strips.